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Case study

MIXED SIGNAL BOARD FOR RECEIVER APPLICATION

MIXED SIGNALS DESIGN

  • Board Size: 150 X 120 mm
  • No of Layers: 10
  • Components: 289
  • Total Pins: 995
  • Connections: 724

FEATURES

  • RF Routing with Isolation and Proper Shielding
  • Analog Design with Splitting Planes
  • RF and Digital Interface with Impedance-Controlled Signals

BOARD DESIGN FOR TELECOMMUNICATION SYSTEM

HIGH DENSE CARD

  • Board Size: 250 X 320 mm
  • No of Layers: 18
  • Signal Layers: 5
  • Components: 2386
  • Total Pins: 9724
  • Connections: 8349

FEATURES

  • DDR2/3 Routing
  • Audio / Video Interface
  • Telecommand Interface
  • Display Interface
  • HMI Interface

CPU BASED BOARD DESIGN

HDI BOARD

  • Board Size: 140 X 120 mm
  • No of Layers: 10
  • Component Density: 23
  • Design with 100u micro Via and Buried Via
  • High Speed Interface

FEATURES

  • High speed Interface with 0.35mm pitch FBGA (Processor) and DDR4

BOARD DESIGN FOR STREET LIGHT CONTROL

HDI BOARD

  • Board Size: 220X 100 mm
  • No of Layers: 4
  • Components: 524
  • Connections: 800

FEATURES

  • Flex routing using two flex layers
  • Complexity high with higher voltage and Isolation