PCB Fabrication
We provide high-quality PCB fabrication services covering a wide range of technologies, from standard single-sided boards to complex multilayer, HDI,
and specialty substrates. Our processes ensure precision, consistency, and compliance with global standards.
Our capabilities include:
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Single, Double & Multilayer PCBs: Fabrication of boards from simple single-sided up to 20+ multilayer stack-ups.
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HDI (High Density Interconnect) Boards: Use of micro vias, blind/buried vias, and sequential lamination for compact, high-performance designs.
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Rigid, Flex & Rigid-Flex Boards: Advanced fabrication techniques for flexible circuits and rigid-flex combinations used in space-constrained designs.
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RF & Microwave PCBs: Use of specialized low-loss materials and tight impedance control for high-frequency applications.
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Metal Core & Thermal Management PCBs: Aluminium or copper-backed PCBs designed to handle higher thermal loads.
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Special Surface Finishes: ENIG (Electroless Nickel Immersion Gold), OSP, Immersion Tin, Hard Gold, Silver, HASL (lead-free & leaded).
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Advanced Via Technologies: Laser-drilled micro vias, via-in-pad, and filled vias to support dense BGA and fine-pitch components.
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Tight Tolerance Manufacturing:
Trace widths, spaces, and hole sizes fabricated with precision to meet high-speed and controlled impedance
needs.
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Controlled Impedance & Dielectric Management: Engineering support to maintain signal integrity in high-speed designs.
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Copper Weights: Capability to fabricate boards with standard and heavy copper for power electronics.
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Silkscreen & Legend Printing: High-resolution inkjet and screen printing methods for clear marking.
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Mechanical Features: Complex cutouts, countersinks, depth routing, edge plating, and beveled edges.
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Quality Assurance: In-process and final inspections using AOI, X-ray, electrical testing, and cross-section analysis.
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Compliance & Certifications: Boards manufactured as per IPC Class 2/3, RoHS, UL, and other customer-specific standards.
Materials Supported:
FR-4, High Tg FR-4, Polyimide, Rogers, Taconic, Teflon, Aluminum-backed laminates, and other specialty substrates.
