We offer complete, end-to-end PCB design services to support innovative electronic solutions across diverse industries. Our experienced team ensures
every design meets technical, functional, and commercial goals.
Our capabilities include:
High-Speed & High-Density PCB Design:Advanced routing for DDR, USB, PCIe, and SerDes interfaces, plus dense BGA and fine-pitch device handling.
Multilayer & HDI Designs: Expertise in 4–20+ layer boards, HDI technology, blind/buried vias, and micro via structures for compact solutions.
Analog, Digital & Mixed Signal Expertise:
Seamless integration of sensitive analog and high speed digital circuits, reducing crosstalk and
noise.
RF & Microwave PCB Design: Specialized in RF layouts with impedance control, antenna design, and RF simulation support.
Rigid, Flex & Rigid-Flex PCB Design:Advanced mechanical and electrical integration for space-constrained applications.
Design for Manufacturability (DFM):Early-stage review to lower production cost, improve yield, and shorten time to market.
Design for Testability (DFT):Integration of accessible test points and scan chains to ease assembly and functional testing.
Thermal Management: Advanced thermal analysis and heat sink integration for high-power systems.
Signal & Power Integrity Analysis: Pre- and post-layout simulations to ensure compliance with EMC/EMI standards and maintain system stability.
Library & Component Engineering: Custom footprint and symbol creation, 3D modeling, and BOM optimization.
Reverse Engineering & Re-Design:Legacy board recreation, updates for obsolete parts, and performance enhancements.
Compliance Support:Designs meeting IPC, RoHS, UL, CE, and other global standards.
